The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips
Summary. This case study of copper interconnect technology in semiconductors identifies three forms of absorptive capacity: disciplinary, domain-specific, and encoded. Firms build disciplinary capacity by engaging with scientific communities while protecting proprietary knowledge. Domain-specific capacity develops through influencing university research and hiring talent. As technology matures, encoded capacity becomes critical, requiring firms to integrate supplier knowledge. Absorptive capacity is multifaceted and shaped by technology type and maturity.
Cite this article
Lim, K.. (2009). The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips. Industrial and Corporate Change. https://doi.org/10.1093/icc/dtp044
Lim, Kwanghui. “The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips.” Industrial and Corporate Change, 2009. https://doi.org/10.1093/icc/dtp044.
Lim, Kwanghui. 2009. “The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips.” Industrial and Corporate Change. https://doi.org/10.1093/icc/dtp044.
@article{lim-2009-many-faces-absorptive-capacity-spillovers,
title = {The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips},
author = {Kwanghui Lim},
journal = {Industrial and Corporate Change},
year = {2009},
doi = {10.1093/icc/dtp044},
url = {https://doi.org/10.1093/icc/dtp044}
}
TY - JOUR TI - The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips AU - Kwanghui Lim JO - Industrial and Corporate Change PY - 2009 DO - 10.1093/icc/dtp044 UR - https://doi.org/10.1093/icc/dtp044 ER -
Details
- DOI
- 10.1093/icc/dtp044
- Categories
- innovation-theory, innovation-networks, general-innovation
- Added
- 2026-04-28