Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level
Summary. UCIe is an open industry standard that enables chiplets from different suppliers to work together in any package configuration. The paper describes the architectural, circuit, channel, and packaging design choices that went into the UCIe 1.0 specification and presents implementation results from their channel and circuit studies.
Cite this article
Sharma, D. D., Pasdast, G., Qian, Z., & Aygün, K.. (2022). Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level. IEEE Transactions on Components Packaging and Manufacturing Technology. https://doi.org/10.1109/tcpmt.2022.3207195
Sharma, Debendra Das, et al. “Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level.” IEEE Transactions on Components Packaging and Manufacturing Technology, 2022. https://doi.org/10.1109/tcpmt.2022.3207195.
Sharma, Debendra Das, Gerald Pasdast, Zhiguo Qian, and Kemal Aygün. 2022. “Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level.” IEEE Transactions on Components Packaging and Manufacturing Technology. https://doi.org/10.1109/tcpmt.2022.3207195.
@article{sharma-2022-universal-chiplet-interconnect-express-ucie,
title = {Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level},
author = {Debendra Das Sharma and Gerald Pasdast and Zhiguo Qian and Kemal Aygün},
journal = {IEEE Transactions on Components Packaging and Manufacturing Technology},
year = {2022},
doi = {10.1109/tcpmt.2022.3207195},
url = {https://doi.org/10.1109/tcpmt.2022.3207195}
}
TY - JOUR TI - Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level AU - Debendra Das Sharma AU - Gerald Pasdast AU - Zhiguo Qian AU - Kemal Aygün JO - IEEE Transactions on Components Packaging and Manufacturing Technology PY - 2022 DO - 10.1109/tcpmt.2022.3207195 UR - https://doi.org/10.1109/tcpmt.2022.3207195 ER -
Details
- DOI
- 10.1109/tcpmt.2022.3207195
- Countries
- United States
- Regions
- North America
- Categories
- general-innovation
- Added
- 2026-04-28